FE & FHE Technology
We are one of the first R&D teams for Flexible Electronics materials in the world. Our team has had wide successful experience and deep knowledge for that.
The first our flexible product ” A method for an ultra thin Si-plates production by the gas ions implantation” was patented in 1983 . Thirteen years before the “Smart Cut” – a base technology for the SOI and MEMS industries at all.
So, we can offer you it, because we’ve known this, perhaps a little bit more than other.
A new look at a flexible electronics production:
( less energy, water, chemicals, space and equipment)
IC, LED, OLED packaging, thermal management, thin and flexible accumulators, sensors and biocompatible microelectronics.
Ultra fine adhesiveless HDI Flexible PCB (FPCB).
No laminates , no THVs drilling and THVs’ metallization
for a direct an adhesiveless FPCB production.
Z-axis metallic conductivity in a polymeric film.
Different metals thickness for the conductive lines of a FPCB.
Chip-scale and 3D (2.5) packaging opportunities.
A width of a metallic conductive line/space is from 5 microns.
A thickness of a conductive layer is from 2 microns.
A polymeric film thickness: 10- 50 microns.
IP and BRAND protective techologies.
Smart ID labels with different sensors for flexible solutions of the IP subjects protection.
New flexible ID system have been based on the photonics
( for quantum IC).
Biocompatible materials and solutions for implantable electronics and sensors. Bactericide materials for bio-medical application.
Adhesiveless materials for HDI FPCB, Rigid-Flex PCB. Effective thermal management for very closed space- TIMs, ultra thin flexible thermal pipes.
R&D for new opportunites of semiconductor and photonics materials for flexible electronics and other applications.
Why Flexible Electronics ?
The world trend- flexible electronics industry.
USA. NEXTFLEX – national project : 150 world leading companies (08/28 2015) . R&D budget is about 2.5 B$\year.
EU. Lead -ESA ,Thales ( Projects : Hermes, E-Brains, Nano Therm and other. Corporations : Siemens, Bosh ,Ericsson, STMicroelectronics, Infineon, AT&S, BASF, Agfa, IMEC and another.
ASIA. National projects in China, Korea, Japan and some another.
FE market revenue + 15-18 % /year up to 2030.
The market revenue 1$-> 50 B$ for the last 10 years
Main market demands : miniaturization, cost, reliable, thermal stability , bio compatible .
Some of our competences and skills for FHE:
1. Flexible Hybrid Electronics (FHE). The first direct additive technology for an adhesiveless HDI FPCB (flexible printed circuit board) production. New adhesiveless coopper clad laminates and another adhesiveless metal cladded films for a standard technology of the FPCB production.
2. The first ultra thin ( 0.1 mm) flexible thermal pipe and other new TIMs . The area sizes are possible up to A4 ( 200×300 mm) format for these products.
3. An unique method for adhesiveless Biocompatible base materials production for implantable electronics. There is an absolutely new level for a reliability of these structures for a dynamic application as for human body, as for other applications.
4. Ultra thin structures “Si into insulator” for flexible electronics (IC, MEMS, sensors), perhaps, it’s a simplest way to obtain the similar to the SOI opportunities just for the three step, without a bonding process.
Volume insulated areas on the Si-wafer, any shapes without a bonding process. It’s an alternative technical solution to the SOI (Si- on- Insulator technology) for IC and MEMS.
The technological advantages :
Cost effective, a direct additive technology for a FPCB and metal cladded laminates production process for three steps. High ecological standard.
Unlimited opportunities for a creating of novel fine structured composite polymeric based materials.
Capabilities for the S2S&R2R production process.
Compatible to all of the standard existing technologies and materials.
Human body compatible materials for bio-med industry.