Home

 

 

RIVALTEC  is the first private high-tech R&D project for Flexible Electronics  in Russia and in the world.

 

 

The first our innovative solution for flexible electronics was a method had allowed to produce the ultra thin and flexible semiconductor plates (wafers). One was created and  patented in 1983.

 

Those thin Si-structures were produced by the cleaving method after the gas ions implantation. That approach is used to SOI, MEMS, PV  and other structures production in semiconductor industry for 25 years yet.

 

Our new adhesiveless flexible  metal clad laminates and a direct additive technology have allowed us to use ones  as for a standard(subtractive) technology for the FPCB and Rigid- Flexible PCB production as for the precise ultra HDI FPCBs production.

We have designed an unique opportunity to create a  Z-axis electrical conductivity into a polymeric film. So, the processes for THVs and its metallization are excluded from the technological map there.

A new kind of  the ultra thin, flexible and highly effective  TIM’s.

Bio- compatible  adhesiveless composite  materials open new opportunities  to design new bio-medical implantable electronics and sensor systems  for IVD application and remote control of human health.

 

SOME OF OUR INNOVATIVE SOLUTIONS FOR FLEXIBLE ELECTRONICS.

A time  line of our R&D experience in FE and FHE.

 

 

 

It’s a time line for some results of our creative R&D team. All of these,  from the world  first thin Si-plate  (h~100 um) was cleaved  in 1983  to the adhesiveless  FPCB and the ultra thin and  flexible TIMs with  Z-axis  conductivity in the first decade of this age.  There are the bactericidal and anti-viral materials for a personal protection now.  See picture above.

 

Our affordable technologies were designed  to share the developed modern technical solutions to high-tech S&M business companies as for FLEXIBLE HYBRID ELECTRONICS , as for related technologies. From R&D to commercialization.  Having used these approaches and technological advantages of our proposal your solutions and  products will become more competitive for cost and time production to the products of the world global players on the market.

Now there are only two patented direct methods to create precise FPCB with the metal conductivity and precise conductor lines for that. The printed methods with the conductive inks are not considered by us as the main approach to create  high sensitive structures, which could be  used  for biocompatible sensor systems by measuring the low level analog signals or for implantable electronic devises. Nothing was globally changed in that direction for the last thirty years. Of course, the hybrid (printed with ink +metal conductors ( FHE approach ) methods could be used for a prototyping and some other applications. But there are a lot of arisen technical problems which should be solved for bio-med sensor systems  at further.

The chemical method of metal deposition on a polymeric carrier (film) is a base   adhesiveless process of the direct technology  has being used for FPCB production at the NEXTFLEX , the base approaches  were designed  by the Endicott Interconnect Technologies (2002-1012 ) and  the I3 Electronics company (which has  acquired IBM Endicott in 2013) in the USA. It was a base point to launch the Flex Tech Alliance (2010) and  the  NEXTFLEX project in a few years after.  In the same period, the electro-chemical method for the adhesiveless additive  process of FPCBs production was created and patented by the Reutov’s  team in Russia. Some later the Rivaltec project was launched in 2010.

Moreover, we have created another method (“Si-into-Insulator”, it’s our internal slang for that) to produce  the full-isolated thin semiconductor volumes on a semiconductor wafer without clean room and other expensive equipment for that. It’s a new technological pathway to design modern devices and sensor systems using the Chip on Flex or Crystal on Flex  approaches and others.

 

IT’S OUR MOTTO “DIES DIEM DOCET” (Latin).

 

Materials

 

 

 

THE  ADHESIVELESS COMPOSITE MATERIALS   FOR FLEXIBLE HYBRID ELECTRONICS.

 

Our original patented methods were designed for the new composite materials and other adhesiveless structures production.

Ones allow us to design a new generation of the different  sensor systems  for Flexible Electronics and other BIO-MED applications.

In the world of flexible electronics, adhesiveless composite materials and adhesiveless laminates have been become pervasive for Flexible Hybrid Electronics also. There are a few  of technologies,which have being used by the  world leading companies to create flexible adhesiveless materials like the copper/polyimide composites. Vacuum deposition of copper onto film or an opposite process when they cast polyimide onto copper, are used to produce these highly performance structures.

As a  result there are  some important advantages which have improved chemical resistance or reliability at elevated temperatures and dynamical application. This opportunity to avoid adhesive allows us to use similar composites in the bio-compatible construction based on those  flexible laminate.  Of course, moisture absorption and delamination or failure of the conductive layers are reduced and  become less likely case from abrupt or other outer hard  influences on the flexible composite structures.

The new market demands like miniaturization, thermal management, bio-compatibility, multi-functional applications of the flexible structures in different outer conditions and many other have being become very crucial  to the product of wearable and flexible electronics .

But there is a very important thing for design, prototyping and production of new products and one is the cost of the applied materials. And the market price is relatively high for those materials, for example a retail price of the standard two sided Cu clad laminate (18/20/18 microns) could be about 350- 400$ per m2. It’s a raw material only. Moreover, there a lot of problem are arisen to the designers team  if you need  another laminate with other thickness or compound of the conductor layers  or film carrier. We met those problems many times during our science and inventor activity.

Sometimes the absence of the needed materials was a main reason to delay some our very prospective solutions and projects even. The applied materials define your possibilities to make something in our real world, because only its properties allow us to realize our ideas in a real subject. New technologies are depended from the base properties of the applied materials. It’s an axiom for engineers.

Probably, we can offer you an  effective solution to avoid all of the written above problems and save your money, ideas and other IP of your new products from your competitors. If you have got a standard equipment set and you are working with a subtractive technology, so you have to consider our approach and materials for your design of new products in flexible electronics. Be faster, creativity and smarter than your competitors in  your activity designing  new products for wearable and flexible electronics.

 

Two kinds of the  standard base materials for Flexible Hybrid Electronics are :  

  • polymeric films: PET, PI, PC, PP and some other;
  • standard metals or/and alloys for flexible electronics; 
  • bio-compatible metals and alloys  for the Bio-Medical application.

So, we can also offer  different combinations of   the  polymeric films and metals without any seed layers and/or adhesives for your projects and ideas.

  

  The main technological capabilities:

 

  • An “absolute” bonding of the metal layer to the  polymeric film carrier, without any adhesives.

  • Wide parameters of conductive layer thickness, compound for  a flexible conductors picture with the ultra fine and thin structures.

  • New structures with highly developed working surfaces onto a large area for the thin and flexible thermal interface materials (TIMs).

  • Z-axis electrical and thermal conductivity into the films of new composite materials. One is used to  the effective thermal management into the very closed areas of miniature devices and for  3D packaging of the SMD electronic components for different tasks.

  • A new reliability level of the flexible structures for  a dynamic application without delamination or failure of the conductor layers or  conductive lines on a FPCB.

  • Inexpensive, adhesiveless cooper clad laminates (CCL) for a standard FPCB production.  The adhesiveless metal clad laminates could be fabricated in accordance with the special customs’ request, for an example, ones could be  with different  conductor layers thickness and its composition  on any sides of  the  polymeric film .

  • Bio-compatible adhesiveless composite materials for bio- medical (implantable) microelectronics and sensor systems.

 

 

THE ULTRA  THIN AND INSULATED

STRUCTURES ON A Si- WAFER.

 

The thin flexible semiconductor  materials for  different sensor systems and other applications in Flexible Hybrid Electronics.

Our approaches allow to create as the thin and flexible Si-plates or/and the ultra thin structures have been volume insulated  into the Si- plates (Si-into-Insulator), as the light guides into the crystals for photonics. See below.

 

 

 

Optical components and materials for IR, LASER and FIBER and other optical sensor systems.

 

 

 

 

  • ZnSe and ZnS FOR HP LASERS   

  • Scanning & Marking Laser Optics  (LP LASERS )

  • High Power Laser Mirrors

  • Aspherical, Cylindrical, Prism Optics

  • Thin Film Coating Services

  • Other high quality and  certified optical  materials,  components and devices in accordance with your request.