RIVALTEC – innovative solutions. Flexible Electronics.
New Flexible Hybrid Electronics technologies and materials are used to a personal smart protection and the IVD control of a human health.
New Flexible Hybrid Electronics technologies and materials are used to a personal smart protection and the IVD control of a human health.
It’s a time line for some results of our creative R&D team. All of these, from the world first thin Si-plate (h~100 um) was cleaved in 1983 to the adhesiveless FPCB and the ultra thin and flexible TIMs with Z-axis conductivity in the first decade of this age. There are the bactericidal and anti-viral materials for a personal protection now. See picture above.
Our affordable technologies were designed to share the developed modern technical solutions to high-tech S&M business companies as for FLEXIBLE HYBRID ELECTRONICS , as for related technologies. From R&D to commercialization. Having used these approaches and technological advantages of our proposal your solutions and products will become more competitive for cost and time production to the products of the world global players on the market.
Now there are only two patented direct methods to create precise FPCB with the metal conductivity and precise conductor lines for that. The printed methods with the conductive inks are not considered by us as the main approach to create high sensitive structures, which could be used for biocompatible sensor systems by measuring the low level analog signals or for implantable electronic devises. Nothing was globally changed in that direction for the last thirty years. Of course, the hybrid (printed with ink +metal conductors ( FHE approach ) methods could be used for a prototyping and some other applications. But there are a lot of arisen technical problems which should be solved for bio-med sensor systems at further.
The chemical method of metal deposition on a polymeric carrier (film) is a base adhesiveless process of the direct technology has being used for FPCB production at the NEXTFLEX , the base approaches were designed by the Endicott Interconnect Technologies (2002-1012 ) and the I3 Electronics company (which has acquired IBM Endicott in 2013) in the USA. It was a base point to launch the Flex Tech Alliance (2010) and the NEXTFLEX project in a few years after. In the same period, the electro-chemical method for the adhesiveless additive process of FPCBs production was created and patented by the Reutov’s team in Russia. Some later the Rivaltec project was launched in 2010.
Moreover, we have created another method (“Si-into-Insulator”, it’s our internal slang for that) to produce the full-isolated thin semiconductor volumes on a semiconductor wafer without clean room and other expensive equipment for that. It’s a new technological pathway to design modern devices and sensor systems using the Chip on Flex or Crystal on Flex approaches and others.
Our original patented methods were designed for the new composite materials and other adhesiveless structures production.
Ones allow us to design a new generation of the different sensor systems for Flexible Electronics and other BIO-MED applications.
In the world of flexible electronics, adhesiveless composite materials and adhesiveless laminates have been become pervasive for Flexible Hybrid Electronics also. There are a few of technologies,which have being used by the world leading companies to create flexible adhesiveless materials like the copper/polyimide composites. Vacuum deposition of copper onto film or an opposite process when they cast polyimide onto copper, are used to produce these highly performance structures.
As a result there are some important advantages which have improved chemical resistance or reliability at elevated temperatures and dynamical application. This opportunity to avoid adhesive allows us to use similar composites in the bio-compatible construction based on those flexible laminate. Of course, moisture absorption and delamination or failure of the conductive layers are reduced and become less likely case from abrupt or other outer hard influences on the flexible composite structures.
The new market demands like miniaturization, thermal management, bio-compatibility, multi-functional applications of the flexible structures in different outer conditions and many other have being become very crucial to the product of wearable and flexible electronics .
But there is a very important thing for design, prototyping and production of new products and one is the cost of the applied materials. And the market price is relatively high for those materials, for example a retail price of the standard two sided Cu clad laminate (18/20/18 microns) could be about 350- 400$ per m2. It’s a raw material only. Moreover, there a lot of problem are arisen to the designers team if you need another laminate with other thickness or compound of the conductor layers or film carrier. We met those problems many times during our science and inventor activity.
Sometimes the absence of the needed materials was a main reason to delay some our very prospective solutions and projects even. The applied materials define your possibilities to make something in our real world, because only its properties allow us to realize our ideas in a real subject. New technologies are depended from the base properties of the applied materials. It’s an axiom for engineers.
Probably, we can offer you an effective solution to avoid all of the written above problems and save your money, ideas and other IP of your new products from your competitors. If you have got a standard equipment set and you are working with a subtractive technology, so you have to consider our approach and materials for your design of new products in flexible electronics. Be faster, creativity and smarter than your competitors in your activity designing new products for wearable and flexible electronics.
So, we can also offer different combinations of the polymeric films and metals without any seed layers and/or adhesives for your projects and ideas.
The thin flexible semiconductor materials for different sensor systems and other applications in Flexible Hybrid Electronics.
Our approaches allow to create as the thin and flexible Si-plates or/and the ultra thin structures have been volume insulated into the Si- plates (Si-into-Insulator), as the light guides into the crystals for photonics. See below.