Flexible PCB

 

 

A cost effective and additive technology for the adhesiveless precise  FPCB production.

The main market  demands for the FPCB design: miniaturization, cost, reliable, thermal stability,  bio compatible.

 

Less energy, water, chemicals, workspace and equipment.

Step1.

A film preparation. All of the needed materials and componets are available on the open market:

PI, PET or other polymeric films (Kapton. Mylar or similar).

A standard film in a roll with : a thickness: 10-50 microns, a width : 320, 640 mm.

Step 2.

A prcise FPCB’s picture creation. Materials for the previous process are:

  • a metal plate in accordance with a size of a FPCB pictire and the film.
  • a standard photoresist and photolitigraphic equiepment to create the needed FPCB’s picture onto a metal plate. A width of the conductor lines could be s from ~ 5 microns for precise FPCB.

Step 3.

On using a standard electroplating process with Cu- electrolyte and equipment you can make a precise structure of a FPCB.
Other metals and alloys could be also used for special tasks like a biocompatible FPCB for bio-med sensor systems.
The thickness of a electroplated layer is from 2 microns, on demand.
All of layers for a multilayer FPCB could be simultaneously produced in the equal conditions at the same time,
A duration of the process (sheet –to -sheet) is :
15-20 min for a single sided FPCB,
30-40 min for a FPCB with a duplicated picture on the back side or for a multilayer FPCB.

Easy, fast, cost effective and ECO friendly.

 

 

  • Ultra fine adhesiveless HDI Flexible PCB (FPCB).

  • No laminates , no THVs  drilling and its metallization

    for the  adhesiveless FPCB  production.

  • Z-axis metallic conductivity into a polymeric film.

  • Chip-scale and 3D (2.5) packaging opportunities.

  • A width of a metallic conductive line/space is from 5 microns.

  • A thickness of a conductive layer is from 2 microns for different metals and alloys on demand.

  • A polymeric film thickness: 10- 50 microns.