Adhesiveless HD FPCB and Rigid- Flexible PCB production:
( less energy, water, chemicals, space and equipment)
Main market demands : miniaturization, cost, reliable, thermal stability , bio compatible .
Base materials, these products are available on the market:
PI, PET and another polymeric films (Kapton. Mylar or similar).
A standard film in a roll: a thickness: 10-50 microns,
a roll width : 320, 640 mm.
The speed of a film treatment : R2R process (3 steps):
1. ~ 1000 m/h; 2. ~50 m/h; 3. ~ 100 m/h.
Materials for a previous process:
A metal plate in accordance with a size of a FPCB pictire and the film.
A standard photoresist and equiepment for HD FPCB picture creation. For ultra fine conductor lines from ~ 5 microns for a width.
A duration of the standard process is ~ 2 hours.
The metal plate with a photolitigraphic pictures has being used for a few times ( up to 5-10 times) in the production process.
A standard Cu- electrolyte. A power supply.
An electroplating bath. A standard washing and drying equipment.
Material of a conductor layer is cooper ( an electroplating quality).
Another metals and alloys could be used.
The thickness of a electroplated layer is from 2 microns , on demand.
All layers of a multilayer FPCB have being prepared at the same time in the equal conditions, simultaneously.
Nobody can do the same yet!
A duration of the process (sheet –by -sheet) is :
15-20 min for a single sided FPCB,
30-40 min for a duplicated picture on the back and for a multilayer FPCB.
The final product’s cost is cheaper
in 3-4 times.
The production process is faster,
in 10 times.
A level of reliability could be higher on orders.
Now, using the Reutov’s technology,
even a scholar can prepare FPCB in a class room .
It could be really affordable for everybody .
Easy, fast, cost effective and ECO friendly.
Ultra fine adhesiveless HDI Flexible PCB (FPCB).
No laminates , no THVs drilling and THVs’ metallization
for a direct an adhesiveless FPCB production.
Z-axis metallic conductivity in a polymeric film.
Different metals thickness for the conductive lines of a FPCB.
Chip-scale and 3D (2.5) packaging opportunities.
A width of a metallic conductive line/space is from 5 microns.
A thickness of a conductive layer is from 2 microns.
A polymeric film thickness: 10- 50 microns.