A cost effective and additive technology for the adhesiveless precise FPCB production.
Less energy, water, chemicals, workspace and equipment.
Step1.
A film preparation. All of the needed materials and componets are available on the open market:
PI, PET or other polymeric films (Kapton. Mylar or similar).
A standard film in a roll with : a thickness: 10-50 microns, a width : 320, 640 mm.
Step 2.
A prcise FPCB’s picture creation. Materials for the previous process are:
- a metal plate in accordance with a size of a FPCB pictire and the film.
- a standard photoresist and photolitigraphic equiepment to create the needed FPCB’s picture onto a metal plate. A width of the conductor lines could be s from ~ 5 microns for precise FPCB.
Step 3.
On using a standard electroplating process with Cu- electrolyte and equipment you can make a precise structure of a FPCB.
Other metals and alloys could be also used for special tasks like a biocompatible FPCB for bio-med sensor systems.
The thickness of a electroplated layer is from 2 microns, on demand.
All of layers for a multilayer FPCB could be simultaneously produced in the equal conditions at the same time,
A duration of the process (sheet –to -sheet) is :
15-20 min for a single sided FPCB,
30-40 min for a FPCB with a duplicated picture on the back side or for a multilayer FPCB.
Easy, fast, cost effective and ECO friendly.
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Ultra fine adhesiveless HDI Flexible PCB (FPCB).
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No laminates , no THVs drilling and its metallization
for the adhesiveless FPCB production.
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Z-axis metallic conductivity into a polymeric film.
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Chip-scale and 3D (2.5) packaging opportunities.
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A width of a metallic conductive line/space is from 5 microns.
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A thickness of a conductive layer is from 2 microns for different metals and alloys on demand.
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A polymeric film thickness: 10- 50 microns.